View PSR-4000BV_184989.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

www..com
TAIYO PSR-4000BV AUS5
LIQUID PHOTOIMAGEABLE SOLDER MASK Designed for Packaging Applications Screen or Spray Application Excellent Thermal and Crack Resistance Hard Surface Finish Fine Dam Resolution RoHS Compliant Excellent Resistance to ENIG and Immersion Tin Plating Compatible with Lead-Free Processing Low Water Absorption
Revised June 2005
www..com
PROCESSING PARAMETERS FOR PSR-4000BV AUS5
PSR-4000BV AUS5 is a two-component, gloss Green, liquid photoimageable solder mask for flood screen printing. PSR-4000BV AUS5 has been specifically designed for BGA, Flip-Chip and other Chip Scale Packaging (CSP) applications. PSR-4000BV AUS5 has excellent moisture resistance properties, very good resistance to ENIG and can withstand pressure cooker type testing (PCT). PSR-4000BV AUS5 meets or exceeds the requirements of IPC SM840C Class H and Class T, Bellcore GR-78-CORE Issue 1, and has a UL flammability rating of 94V-0. All Taiyo America products comply with the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the Restriction of the use of certain Hazardous Substances (RoHS) in electrical and electronic equipment.
PSR-4000BV AUS5 COMPONENTS
PSR-4000BV AUS5 / Mixing Ratio 100 parts Color Green Mixed Properties Solids 76% Viscosity 200 - 240 ps Specific Gravity 1.36
CA-40BB 43 parts White
MIXING
PSR-4000BV AUS5 is supplied in pre-measured containers with a mix ratio by weight of 100 parts PSR-4000BV AUS5 and 43 parts CA-40BB. PSR-4000BV AUS5 can be mixed by hand with a mixing spatula for 10 - 15 minutes. Mixing can be done with a mechanical mixer at low speeds to minimize shear thinning for 10 - 15 minutes. Also, mixing can be done with a paint shaker for 10 - 15 minutes.
PRE-CLEANING
Prior to solder mask application, the printed circuit board surface needs to be cleaned. Various cleaning methods include Pumice, Aluminum Oxide, Mechanical Brush, and Chemical Clean. All of these methods will provide a clean surface for the application of PSR-4000BV AUS5. Hold time after cleaning the printed circuit board should be held to a minimum to reduce the oxidation of the copper surfaces.
Page 2 of 7
www..com
PROCESSING PARAMETERS FOR PSR-4000BV AUS5
SCREEN PRINTING Method: Single Sided and Double Sided Screening * Screen Mesh: 74 - 110 * Screen Mesh Angle: 22.5 Bias * Screen Tension: 20 - 28 Newtons * Squeegee: 60 - 80 durometer * Squeegee Angle: 27 - 35 * Printing Mode: Flood / Print / Print * Flood Pressure: 20 - 30 psi * Printing Speed: 2.0 - 9.9 inches/sec * Printing Pressure: 70 - 100 psi
TACK DRY CYCLE
The Tack Dry step is required to remove solvent from the solder mask film and produce a firm dry surface. The optimum dwell time and oven temperature will depend on oven type, oven loading, air circulation, exhaust rate, and ramp times. Excessive tack dry times and temperature will result in difficulty developing solder mask from through holes and a reduction in photo speed. Insufficient tack dry will result in artwork marking and/or sticking. Typical tack dry conditions for PSR-4000BV AUS5 is as followed: * * * * Oven Temperature: 160 - 180F (71 - 82C) For Single-Sided (Batch Oven) 1st Side: Dwell Time: 15 - 20 minutes 2nd Side: Dwell Time: 35 - 45 minutes For Double-Sided (Conveyorized or Batch Oven) Dwell Time: 35 - 60 minutes
EXPOSURE
PSR-4000BV AUS5 requires UV exposure to define solder mask dams and features. The spectral sensitivity of PSR-4000BV AUS5 is in the area of 365 nm. Exposure times will vary by bulb type and age of the bulb. Below are guidelines for exposing PSR-4000BV AUS5. * Exposure Unit: 5 kW or higher * Stouffer Step 21: Clear 10 minimum (on metal / under phototool) * Energy: Minimum 300 mJ / cm2 (under phototool)
Page 3 of 7
www..com
PROCESSING PARAMETERS FOR PSR-4000BV AUS5
DEVELOPMENT PSR-4000BV AUS5 is developed in an aqueous sodium or potassium carbonate solution. Developing can be done in either a horizontal or vertical machine. * * * * * * Solution: 1% by wt. Sodium Carbonate or 1.2% Potassium Carbonate pH: 10.6 or greater Temperature: 85 - 105F (29 - 41C) Spray Pressure: 25 - 45 psi Dwell Time in developing chamber: 45 - 75 seconds Water rinse is needed to remove developer solution & dry
FINAL CURE PSR-4000BV AUS5 needs to be thermally cured to insure optimal final property performance. Thermal curing can be done in a batch oven or conveyorized oven. * * Temperature: 275 - 300F (135 - 149C) Time at Temperature: 45 - 60 minutes
UV CURE PSR-4000BV AUS5 also requires a UV cure to insure optimal final property performance. The recommended process for UV curing is as follows: * * UV Energy: 3000 mJ / cm2 Lamps: High Pressure Mercury Lamps
For Process Optimization, or Specific guides to Spray Application or IR drying and curing, please contact your local Taiyo America Representative
Page 4 of 7
www..com
FINAL PROPERTIES FOR PSR-4000BV AUS5
IPC-SM-840C, Class H & T, Solder Mask Vendor Testing Requirements
TEST Visual Curing Non-Nutrient Dimensional Pencil Hardness Adhesion Machinability Resistance to Solvents and Cleaning Agents Hydrolytic Stability and Aging Solderability Resistance to Solder Dielectric Strength Thermal Shock SM-840 PARAGRAPH 3.4.8 3.4.5 3.4.6 3.4.10 3.5.1 3.5.2 3.5.3 3.6.1.1 3.6.2 3.7.1 3.7.2 3.8.1 3.9.3 REQUIREMENT Uniform in Appearance Ref: 3.6.1.1, 3.7.1 and 3.7.2 Does not contribute to biological growth No Solder Pickup and Withstand 500 VDC Minimum "F" Rigid - Cu, Ni, FR-4 No Cracking or Tearing Table 3 Solvents No Change after 28 days of 95-99C and 90-98% RH No Adverse Effect J-STD-003 No Solder Sticking 500 VDC / mil Minimum No Blistering, Crazing or De-lamination RESULT Pass Pass Pass Pass Pass - 6H Pass Pass Pass Pass Pass Pass 3600 VDC/mil Pass
Specific Class "H" Requirements
TEST Flammability Insulation Resistance Before Soldering After Soldering Moisture & Insulation Resistance Before Soldering-In Chamber Before Soldering-Out of Chamber After Soldering-In Chamber After Soldering-Out of Chamber Electrochemical Migration SM-840 PARAGRAPH 3.6.3 3.8.2 REQUIREMENT UL 94V-0 5 x 108 ohms minimum 5 x 108 ohms minimum 5 x 108 ohms minimum 5 x 108 ohms minimum 5 x 108 ohms minimum 5 x 108 ohms minimum >2.0 x 106 ohms, no dendritic growth RESULT Pass - File #E166421 Pass (4.18 x 1012 ohms) Pass (1.51 x 1013 ohms) Pass (1.53 x 1010 ohms) Pass (1.07 x 1012 ohms) Pass (1.42 x 1010 ohms) Pass (1.16 x 1012 ohms) Pass (4.69 x 1012 ohms)
3.9.1
3.9.2
Specific Class "T" Requirements
TEST Flammability Insulation Resistance Before Soldering After Soldering SM-840 PARAGRAPH 3.6.3 3.8.2 REQUIREMENT Bellcore 02 Index - 28 minimum 5 x 108 ohms minimum 5 x 108 ohms minimum RESULT Pass - 74 Pass (2.55 x 1012 ohms) Pass (8.86 x 1010 ohms)
Page 5 of 7
www..com
FINAL PROPERTIES FOR PSR-4000BV AUS5
Specific Class "T" Requirements
TEST Moisture & Insulation Resistance Before Soldering-In Chamber Before Soldering-Out of Chamber After Soldering-In Chamber After Soldering-Out of Chamber Electrochemical Migration SM-840 PARAGRAPH 3.9.1 REQUIREMENT 5 x 108 ohms minimum 5 x 108 ohms minimum 5 x 108 ohms minimum 5 x 108 ohms minimum < 1 decade drop, no dendritic growth RESULT Pass (9.22 x 109 ohms) Pass (2.6 x 1013 ohms) Pass (4.08 x 109 ohms) Pass (6.4 x 1012 ohms) Pass
3.9.2
Additional Tests / Results
TEST Volume Resistivity Dielectric Constant Dissipation Factor Electroless Gold Plating Resistance Electrolytic Gold Plating Resistance Water Absorption REQUIREMENT Internal Test: 25 - 65C / 90% RH / 7 Days Internal Test: @ 1 MHz 25 - 65C / 90% RH / 7 Days Internal Test @ 1 MHz 25 - 65C / 90% RH / 7 Days 3 - 5 microns Nickel / .03 microns Gold 5 - 10 microns Nickel / .03 microns Gold 85C / 85% RH (% Weight Gain) RESULT Initial: 4.5 x 1014 ohm-cm Final: 2.9 x 1013 ohm-cm Initial: 4.71 Final: 5.22 Initial: 0.0332 Final: 0.0466 No Peeling No Peeling 1 Hour: 0.65% 2 Hours: 0.73% 168 Hours: 0.84% No Peeling < 31 Dynes / cm 42 Dynes / cm 34 Dynes / cm 104.8C 0.467 0.26 3500 MPa 3.0 1.5 2.19 Kg / mm2 1.1 3.46 x 103 Kg / mm2 R/2 = 12.7mm Weight = 300g High = 500mm 6 x 10-5 1.6 x 10-4
Pressure Cooker Wettability (Surface Tension)
Tg Poisson Ration Thermal Conductivity (W/mk) Young's Modulus Ericsen Test Tensile Modulus
Fracture Toughness
After Ni/Au plating (121C/100%RH/100hrs) Internal Test: After Curing: After Gold Plating: After (170C / 7 Hours): TMA Method Internal Test Laser Flash (t 1/2 ) Internal Test Tensilon TM-H-20 Internal Test - Pushing Distance (3mm) Specific Gravity: Tensile Force: Tensile Force Ratio: Initial Elasticity Internal Test
Coefficient of Linear Expansion
TMA Method
Below Tg: Above Tg:
Page 6 of 7
www..com
FINAL PROPERTIES FOR PSR-4000BV AUS5
TEST Dielectric Constant REQUIREMENT Internal Test at: 1 MHz 1 GHz 5 GHz 10 GHz 1 MHz 1 GHz 5 GHz RESULT 4.3 4.0 3.8 3.3 0.0330 0.0280 0.0290 TML-0.40% CVCM-0.01% Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass 100/100 100/100 100/100 Excellent
Dissipation Factor
Internal Test at: TML 1% CVCM 0.10% Nickel (85C/30 min) Tape Test Adhesion No attack - 24 hours No attack - 24 hours No attack - 24 hours No attack - 24 hours No attack - 30 Minutes No attack - 30 Minutes No attack - 30 Minutes No attack - 15 Minutes
Outgassing Test ASTM E-595-90 A 2 J/cm2 UV Cure was done after thermal cure. Electroless Nickel / Immersion Gold Resistance Solvent Resistance Acetone: MEK: IPA: PMA: Acid Resistance HCI - 10%: H2SO4 - 10%: Base Resistance NaOH - 10%: Boiling Water Resistance: Solder / Flux Resistance (Alphametals) Alpha 857 water soluble: NR060 no-clean: 3355-NB rosin-based: NR-3000A4 no-clean: Solder / Flux Resistance (Multicore) X32-10M no-clean: X32-06I no-clean: Solder / Flux Resistance - (Sanwa) SR-270 rosin-based: Conformal Coating Adhesion: Humiseal 1 B31 acrylic: Humiseal 1A20 urethane: Dow Corning 3-1753 silicone: Glue Dot Adhesion - Loctite 3609
No attack - 1 x 10 sec float (260C) No attack - 1 x 10 sec float (260C) No attack - 1 x 10 sec float (260C) No attack - 1 x 10 sec float (260C) No attack - 1 x 10 sec float (260C) No attack - 1 x 10 sec float (260C) No attack - 1 x 10 sec float (260C) Crosscut (10/10) after tape Crosscut (10/10) after tape Crosscut (10/10) after tape Adhesion of Glue Dot to PSR-4000BV AUS5
Taiyo America, Inc. (TAIYO) warrants its products to be free from defects in materials and workmanship for the specified warranty period (PSR-4000BV o AUS5 / CA-40BB Warranty period is 7 Months) provided the customer has, at all times, stored the ink at a temperature of 68 F or less. TAIYO accepts no responsibility or liability for damages, whether direct, indirect, or consequential, resulting from failure in the performance of its products. If a TAIYO product is found to be defective in material or workmanship, its liability is limited to the purchase price of the product found to be defective. TAIYO MAKES NO OTHER WARRANTY, EXPRESS OR IMPLIED, AND MAKES NO WARRANTY OF MERCHANTABILITY OR OF FITNESS FOR ANY PARTICULAR PURPOSE. TAIYO'S obligation under this warranty shall not include any transportation charges or costs of installation or any liability for direct, indirect, or consequential damages or delay. If requested by TAIYO, products for which a warranty claim is made are to be returned transportation prepaid to TAIYO'S factory. Any improper use or any alteration of TAIYO'S product by the customer, as in TAIYO'S judgment affects the product materially and adversely, shall void this limited warranty.
Page 7 of 7

▲Up To Search▲

Price & Availability of PSR-4000BV

	To Download PSR-4000BV Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .